Class 4 materials include brittle ceramics and electronic components such as multilayer capacitors and MEMS devices. These materials are highly sensitive to mechanical stress during preparation and require careful handling to preserve delicate internal structures and prevent surface damage.
Metal and ceramic layers in MLCs may separate if excessive force is applied during grinding or polishing.
Porous ceramics may fracture or crush under grinding unless properly supported with resin.
Hard/soft layering causes uneven material removal, obscuring fine internal features.
Thin coatings or films can be easily removed or distorted without controlled prep conditions.
Use low-force wafering saws with diamond blades and adequate cooling to prevent edge chipping.
Vacuum impregnation is essential to fill internal voids and stabilize fragile features prior to grinding.
Use very fine diamond or alumina abrasives with low pressure. Avoid coarse SiC papers to reduce risk of delamination.
Polish using low-napped cloths with diamond followed by colloidal silica. Minimize relief and preserve interfaces.
Confirm ceramic-metal layers remain flat and intact
Check for absence of polishing relief at layer boundaries
Ensure voids are clean and fully visible
Verify coatings and films are undisturbed