PACE Technologies' monocrystalline diamond polishing abrasives deliver sharp, angular cutting action for high-efficiency material removal in metallographic sample preparation. These single-crystal abrasives are best suited for applications requiring aggressive polishing and long abrasive life. Ideal for metals and alloys, monocrystalline diamond supports a consistent, repeatable polishing process that minimizes polishing times and enhances throughput in quality control and research environments.
Key Tips for Monocrystalline Diamond Polishing
Choose the Right Viscosity: High-viscosity for rapid removal; low-viscosity for fine control or sensitive samples.
Use Compatible Pads: Pair with low-nap or resilient pads for optimal flatness and abrasive efficiency.
Control Force and Duration: Monocrystalline diamond is aggressive—use moderate pressure and shorter cycles.
Clean Thoroughly: Rinse specimens and equipment between steps to avoid abrasive carryover.
Monocrystalline diamond polishing plays a vital role in producing sharp, high-resolution surface finishes in metallographic sample preparation. Composed of single-crystal diamond particles, these abrasives exhibit angular, blocky shapes that deliver fast, aggressive cutting action—ideal for metals and harder materials. Monocrystalline diamond is best used with resilient, low- to medium-napped polishing pads to maintain planarity and minimize smearing. Proper selection of abrasive size, suspension medium, and compatible lubrication ensures precise, efficient polishing with consistent material removal and excellent edge retention.
Diamond Abrasive Selection Guidelines
This reference outlines best-practice abrasive sizes for rough and final polishing across metals, ceramics, and composite materials. Proper abrasive selection is critical to ensure accurate microstructural representation, prevent surface damage, and optimize polishing efficiency.
Preferred Abrasive
Acceptable Alternative
Not Typically Recommended
Polishing Guide for Metals
Metal
Rough Polishing (Diamond)
Final Polishing (Oxide)
Abrasive Size
9 µm
6 µm
3 µm
1 µm
Al2O3
SiO2
Aluminum
Copper / Brass
Stainless Steel
Soft Steel
Hard Steel
Tool Steel
Titanium
Etch Polish
Zinc, Tin, Lead
Polishing Guide for Ceramics and Composites
Ceramic / Composite
Coarse Grind
Fine Grind
Rough Polish
Fine Polish
Diamond Size
30 µm
15 µm
9 µm
6 µm
3 µm
1 µm + SiO2
Alumina
Silicon Nitride
Polymer Composite
Metal Matrix Composite
Ceramic Matrix Composite
Cermet
Note: These selections reflect proven laboratory procedures balancing speed, flatness, and structure preservation. Adjust abrasive types and sequence for material-specific variables such as grain size, hardness, and thermal sensitivity.
Polishing Pad Selection Guideline
Pad Image & Link
Use Case
Pad Icon
Polishing Stage
CERMESH metal mesh pad used for semi-fixed abrasive coarse to intermediate lapping.
Excellent for initial removal of damage from sectioning and hard materials.
Coarse / Intermediate
POLYPAD is a durable synthetic polyester pad ideal for intermediate polishing, especially
with 6–15 µm diamond abrasives. Designed as a long-life nylon alternative.
Intermediate
TEXPAN is a widely used non-woven intermediate polishing pad, compatible with most
diamond suspensions. Effective across a broad range of materials.
Intermediate
Black CHEM 2 is a porometric polymer pad with rubber-like consistency, offering balanced action
between low and high nap pads. Ideal for moderate nap intermediate polishing.
Intermediate
DACRON II is a low-napped soft polishing pad widely used in Europe for intermediate steps on
metals. Suitable for 1–15 µm diamond abrasives.
Intermediate
NYPAD is a low-napped silk pad tailored for intermediate polishing of harder metals and alloys.
Performs well with mid-size diamond abrasives.
Intermediate
GOLD PAD is a low-napped pad ideal for 1–9 µm polishing. Designed for consistent material
removal and flatness control during final pre-polishing.
Intermediate
ATLANTIS is a woven low-nap final polishing pad with foam backing for enhanced compliance.
Ideal for 1–6 µm diamond. Great for critical surface flatness needs.
Final
MICROPAD is a high-napped final polishing pad ideal for producing a mirror finish on metals and
polymers. Recommended for <1 µm diamond or colloidal silica.
Final
TRICOTE is a tight high-napped final polishing pad for metals. Offers better control of surface
texture and minimal abrasive drag.
Final
NAPPAD is a very high-napped final polishing pad tailored for soft metals and polymers.
Provides gentle polishing action to minimize pull-out and relief.
Final
MOLTEC 2 is a wool-based final polishing cloth used when edge retention is not critical.
Works well with alumina and colloidal silica on metals.
Final
FELT PAD is a thick final polishing pad made for large samples or glass. Ideal for use with
colloidal silica or alumina slurries where surface uniformity is key.
Monocrystalline diamond polishing is commonly used in one or more stages to remove grinding damage and achieve smooth, reflective surfaces on metals and hard materials. The sharp, angular particles of monocrystalline diamond provide aggressive cutting, making it ideal for high-efficiency rough and intermediate polishing. Use coarser grades for initial steps, followed by finer grades to refine the surface. To avoid surface damage, polishing time and pressure should be carefully controlled.
Minimizing Polishing Artifacts
To reduce edge rounding, relief, and embedding during monocrystalline diamond polishing:
Choose the correct abrasive size and viscosity for the material and stage
Use low-nap or non-woven pads to support flat, uniform surfaces
Ensure platens are flat and runout is under 2.5 µm (for 8" discs)
Apply even pressure and limit polishing durations to avoid over-polishing
Consistent preparation practices and a well-maintained polishing surface are key to reproducible results.
Recommended Procedures
Secure the polishing pad firmly onto a flat, clean platen
Apply several beads of monocrystalline diamond suspension or extender to initiate pad wetting — avoid full saturation
Dispense additional diamond at a rate of 1–2 drops every 10–15 seconds during polishing, depending on speed and sample area
Introduce a compatible lubricant to reduce heat and optimize abrasive performance
For ceramic and mineral specimens, alternate diamond and colloidal silica (e.g., SIAMAT) for enhanced chemomechanical polishing (CMP)
Begin polishing with moderate force to leverage the sharp, angular cutting action of monocrystalline diamond
During the final 15 seconds of the cycle, flush the pad and specimen with water to remove residue and condition the surface
After polishing, rinse specimens thoroughly and dry completely before microscopic inspection
Troubleshooting
Symptom
Cause
Solution
Coarse Scratching
Old or contaminated suspension; excessive abrasive pressure
Use fresh monocrystalline suspension; reduce applied force
Uneven Material Removal
Poor abrasive distribution or inconsistent pad contact
Ensure even application of suspension; verify flat, stable platen setup
Pad Glazing
Diamond buildup or insufficient flushing
Flush regularly with water or alcohol; condition or replace pad
Edge Rounding
Over-polishing or inappropriate pad compliance
Reduce polishing time; use a firmer pad to maintain edge definition
Low Material Removal Rate
Low abrasive loading or degraded diamond suspension
Reapply suspension more frequently; check expiration of abrasive
Specimen Drag or Pad Tearing
Insufficient lubrication with high downforce
Increase lubricant volume; reduce pressure
Surface Smearing or Pull-Out
Overly aggressive grit size for specimen material
Switch to finer monocrystalline grit; ensure pad matches application