Our selection of sectioning consumables is designed for precision and efficiency in metallographic sample preparation. We offer a range of abrasive blades, diamond blades, and cutting fluids to accommodate various materials and cutting conditions. These consumables ensure minimal deformation and optimal surface integrity, supporting accurate microstructural analysis.
Tips
- Choose the Right Technique - Use abrasive sectioning for hard materials and diamond wafering for delicate samples requiring minimal damage.
- Minimize Heat and Deformation - Diamond wafering reduces thermal damage in heat-sensitive materials.
- Optimize Surface Quality - Precision wafering ensures a smooth finish for microstructural analysis.
- Maximize Efficiency - Abrasive sectioning is faster and cost-effective for routine cutting of tough materials.
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