Magnetic Polishing System
PACE Technologies’ magnetic polishing system streamlines sample preparation by combining magnetic-backed polishing pads with durable magnetic baseplates. This flexible setup allows for quick pad changes and reliable flatness, all while maintaining precise control across both rough and final polishing stages. Compatible with alumina, diamond, and colloidal silica suspensions, our magnetic system is optimized for high-throughput metallography labs and research facilities.
Our magnetic-backed pads securely adhere to magnetic baseplates, enabling fast pad swaps with no adhesive residue.
Why Use Magnetic Polishing?
- Tool-Free Setup: Easily switch polishing cloths without mess or downtime.
- Consistent Results: Stable adhesion improves contact uniformity and repeatability.
- Versatile Sizes: Available for 8", 10", 12", and 14" platens.
- Pair with Our Pads: Choose from a full range of rough and final magnetic-backed polishing cloths.
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Introduction
Selecting the right metallographic polishing pad is essential for achieving precise, repeatable surface finishes in sample preparation. Pads vary in nap height, backing type, and material composition, which impacts abrasive support, flatness, and edge retention. Low-napped pads paired with diamond abrasives are used in rough polishing to remove grinding damage, while high-napped cloths and fine abrasives like alumina or colloidal silica are ideal for final polishing. Choosing the correct pad minimizes artifacts such as edge rounding, relief, and smear, ensuring accurate microstructural analysis.
Polishing Pad (MAG) Selection Guideline
| Pad Image & Link | Use Case | Pad Icon | Polishing Stage |
|---|---|---|---|
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CERMESH metal mesh pad used for semi-fixed abrasive coarse to intermediate lapping. Excellent for initial removal of damage from sectioning and hard materials. |
|
Coarse / Intermediate |
|
POLYPAD is a durable synthetic polyester pad ideal for intermediate polishing, especially with 6–15 µm diamond abrasives. Designed as a long-life nylon alternative. |
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Intermediate |
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TEXPAN is a widely used non-woven intermediate polishing pad, compatible with most diamond suspensions. Effective across a broad range of materials. |
|
Intermediate |
|
Black CHEM 2 is a porometric polymer pad with rubber-like consistency, offering balanced action between low and high nap pads. Ideal for moderate nap intermediate polishing. |
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Intermediate |
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DACRON II is a low-napped soft polishing pad widely used in Europe for intermediate steps on metals. Suitable for 1–15 µm diamond abrasives. |
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Intermediate |
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NYPAD is a low-napped silk pad tailored for intermediate polishing of harder metals and alloys. Performs well with mid-size diamond abrasives. |
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Intermediate |
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GOLD PAD is a low-napped pad ideal for 1–9 µm polishing. Designed for consistent material removal and flatness control during final pre-polishing. |
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Intermediate |
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ATLANTIS is a woven low-nap final polishing pad with foam backing for enhanced compliance. Ideal for 1–6 µm diamond. Great for critical surface flatness needs. |
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Final |
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MICROPAD is a high-napped final polishing pad ideal for producing a mirror finish on metals and polymers. Recommended for <1 µm diamond or colloidal silica. |
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Final |
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TRICOTE is a tight high-napped final polishing pad for metals. Offers better control of surface texture and minimal abrasive drag. |
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Final |
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NAPPAD is a very high-napped final polishing pad tailored for soft metals and polymers. Provides gentle polishing action to minimize pull-out and relief. |
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Final |
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MOLTEC 2 is a wool-based final polishing cloth used when edge retention is not critical. Works well with alumina and colloidal silica on metals. |
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Final |
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FELT PAD is a thick final polishing pad made for large samples or glass. Ideal for use with colloidal silica or alumina slurries where surface uniformity is key. |
|
Final |
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Process Description
Polishing typically involves two stages: rough and final. Rough polishing removes deformation from grinding using low-napped pads and polycrystalline diamond abrasives. Final polishing uses high-napped cloths and finer abrasives such as alumina or colloidal silica to eliminate minor defects.
Using magnetic-backed pads simplifies transitions between stages and ensures consistent flatness due to firm, uniform adhesion across the platen. This stability minimizes polishing artifacts and helps maintain process control across multiple specimens.
Excessive polishing can cause artifacts like relief, edge rounding, and smear, so polishing time should be minimized.
Minimizing Polishing Artifacts
To reduce edge rounding, phase relief, smear, and grain pull-out:
- Minimize sectioning and grinding damage upfront
- Use the finest effective abrasive at each stage
- Ensure polishing plates are flat (≤2.5 µm runout for 8" plates)
- Use magnetic systems to maintain stable, reusable pad alignment
Recommended Procedures
- Place magnetic-backed pad on a clean magnetic baseplate
- Pre-charge pad with abrasive suspension, paste, or powder
- Apply appropriate lubricant
- Begin polishing with reduced force to avoid tearing
- Clean specimen and pad during the last 10–15 seconds
- Wipe both pad and baseplate dry before storage to avoid corrosion
Troubleshooting
| Symptom | Cause | Solution |
|---|---|---|
| Coarse Scratching | Contamination on polishing pad | Replace pad with a clean magnetic-backed version |
| Tearing of Pad | Excessive force or poor lubrication | Reduce force; improve lubrication and ensure full pad contact on magnet |
| Pad Slipping or Lifting | Contaminated baseplate or warped pad | Clean baseplate surface thoroughly; ensure pad is flat and undamaged |
| Excessive Relief / Edge Rounding | Improper pad selection or prolonged polishing | Use suitable nap pad; minimize final polish duration and verify flatness |