PACE Technologies' polycrystalline diamond polishing abrasives are designed for rapid material removal with minimal surface damage. Featuring a multi-faceted crystal structure, these abrasives enhance surface leveling and reduce sub-surface deformation, making them ideal for polishing hard and brittle materials. Compatible with a wide range of polishing cloths and lubricants, polycrystalline diamond provides superior performance in both intermediate and final polishing stages.
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For Monocrystalline Diamond Polishing
Polycrystalline diamond polishing is a critical step in achieving uniform, high-quality surface finishes during metallographic sample preparation. With its multi-faceted crystal structure, polycrystalline diamond offers superior material removal rates and minimized subsurface damage, especially on hard and brittle materials. These abrasives are best used with low- to medium-napped polishing pads to maintain flatness and avoid issues like relief or edge rounding. Selecting the proper viscosity and suspension format—paired with the right cloth and lubrication—ensures efficient, reproducible polishing results for accurate microstructural analysis.
This reference outlines best-practice abrasive sizes for rough and final polishing across metals, ceramics, and composite materials. Proper abrasive selection is critical to ensure accurate microstructural representation, prevent surface damage, and optimize polishing efficiency.
Metal | Rough Polishing (Diamond) | Final Polishing (Oxide) | ||||
---|---|---|---|---|---|---|
Abrasive Size | 9 µm | 6 µm | 3 µm | 1 µm | Al2O3 | SiO2 |
Aluminum | ||||||
Copper / Brass | ||||||
Stainless Steel | ||||||
Soft Steel | ||||||
Hard Steel | ||||||
Tool Steel | ||||||
Titanium | Etch Polish | |||||
Zinc, Tin, Lead |
Ceramic / Composite | Coarse Grind | Fine Grind | Rough Polish | Fine Polish | ||
---|---|---|---|---|---|---|
Diamond Size | 30 µm | 15 µm | 9 µm | 6 µm | 3 µm | 1 µm + SiO2 |
Alumina | ||||||
Silicon Nitride | ||||||
Polymer Composite | ||||||
Metal Matrix Composite | ||||||
Ceramic Matrix Composite | ||||||
Cermet |
Note: These selections reflect proven laboratory procedures balancing speed, flatness, and structure preservation. Adjust abrasive types and sequence for material-specific variables such as grain size, hardness, and thermal sensitivity.
Polycrystalline diamond polishing is typically performed in one or two stages depending on material hardness and surface condition. For rough polishing, low- to medium-napped pads are used with coarse polycrystalline diamond suspensions or pastes to efficiently remove grinding damage. In many cases, this may be followed by a finer grade of polycrystalline diamond for surface refinement. Due to the abrasive’s multi-crystalline nature, material removal is rapid yet controlled, minimizing heat and deformation. Excessive polishing should be avoided to prevent artifacts such as relief, smear, or rounding.
To prevent common polishing issues such as edge rounding, relief, or abrasive embedding:
Symptom | Cause | Solution |
---|---|---|
Coarse Scratching | Contaminated polishing pad or incorrect pad pairing | Replace pad; use correct pad type for polycrystalline diamond |
Agglomerated Diamond | Pre-mixing with colloidal silica; bacterial growth in suspension | Dispense abrasives separately; replace suspension if contaminated |
Uneven Polishing | Worn pad or uneven platen surface | Replace pad; check and resurface platen if needed |
Edge Rounding / Excessive Relief | Too much downforce or extended polishing duration | Reduce force; shorten polishing time; verify prior steps were sufficient |
Low Polishing Rate | Insufficient abrasive concentration or poor pad saturation | Increase suspension application rate; recharge pad with diamond |
Tearing of Pad | High pressure or inadequate lubrication | Lower pressure; apply lubricant more frequently |
Specimen Smear or Pull-Out | Inappropriate pad or overly aggressive abrasive size | Use lower nap pad and finer diamond grit; evaluate pad compatibility |
Description | Quantity | Catalog Number | Product Image |
---|---|---|---|
1 micron (blue) DIAMAT PC Suspension | 1 liter | PC-1001-1L | ![]() |
1 micron (blue) DIAMAT PC Suspension | 1 gallon | PC-1001-1GLB | |
3 micron (green) DIAMAT PC Suspension | 1 liter | PC-1003-1L | ![]() |
3 micron (green) DIAMAT PC Suspension | 1 gallon | PC-1003-1GLG | |
6 micron (yellow) DIAMAT PC Suspension | 1 liter | PC-1006-1L | ![]() |
6 micron (yellow) DIAMAT PC Suspension | 1 gallon | PC-1006-1GLY | |
9 micron (red) DIAMAT PC Suspension | 1 liter | PC-1009-1L | ![]() |
9 micron (red) DIAMAT PC Suspension | 1 gallon | PC-1009-1GLR | |
15 micron (brown) DIAMAT PC Suspension | 1 liter | PC-1015-1L | ![]() |
15 micron (brown) DIAMAT PC Suspension | 1 gallon | PC-1015-1GLBR | |
30 micron (orange) DIAMAT PC Suspension | 1 liter | PC-1030-1L | ![]() |
30 micron (orange) DIAMAT PC Suspension | 1 gallon | PC-1030-1GLO | |
45 micron (purple) DIAMAT PC Suspension | 1 liter | PC-1045-1L | ![]() |
45 micron (purple) DIAMAT PC Suspension | 1 gallon | PC-1045-1GLP |
Description | Quantity | Catalog Number | Product Image |
---|---|---|---|
DIAMAT Polycrystalline Diamond Paste (0.1 µm) | 5 gm 20 gm |
PC-0210-05 PC-0210-20 |
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DIAMAT Polycrystalline Diamond Paste (0.25 µm) | 5 gm 20 gm |
PC-0225-05 PC-0225-20 |
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DIAMAT Polycrystalline Diamond Paste (0.5 µm) | 5 gm 20 gm |
PC-0250-05 PC-0250-20 |
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DIAMAT Polycrystalline Diamond Paste (1 µm) | 5 gm 20 gm |
PC-2001-05 PC-2001-20 |
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DIAMAT Polycrystalline Diamond Paste (3 µm) | 5 gm 20 gm |
PC-2003-05 PC-2003-20 |
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DIAMAT Polycrystalline Diamond Paste (6 µm) | 5 gm 20 gm |
PC-2006-05 PC-2006-20 |
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DIAMAT Polycrystalline Diamond Paste (9 µm) | 5 gm 20 gm |
PC-2009-05 PC-2009-20 |
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DIAMAT Polycrystalline Diamond Paste (15 µm) | 5 gm 20 gm |
PC-2015-05 PC-2015-20 |
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DIAMAT Polycrystalline Diamond Paste (30 µm) | 5 gm 20 gm |
PC-2030-05 PC-2030-20 |
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DIAMAT Polycrystalline Diamond Paste (45 µm) | 5 gm 20 gm |
PC-2045-05 PC-2045-20 |
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