Precision Wafering Consumables
Our precision wafering consumables offer clean, accurate cuts for delicate materials like semiconductors and ceramics. With diamond wafering blades and specialized fluids, they minimize damage and ensure consistent results for microstructural analysis.
Explore our advanced precision sectioning equipment, designed for precision and efficiency.
Key Tips for Precision Wafering
- Choose the Correct Wafering Blade: Select a diamond blade suited to the material's brittleness and thickness for precise, clean cuts.
- Ensure Optimal Coolant Flow: Maintain proper coolant flow to minimize friction and heat, protecting delicate structures.
- Adjust Wafering Speed: Use appropriate speeds—lower speeds for fragile materials and higher speeds for tougher ones.
- Secure the Sample Firmly: Clamp the sample securely to prevent movement and ensure uniform, accurate wafering.
More Information:
Introduction
Precision wafer cutting is typically performed with diamond wafering blades, but for certain materials, cubic boron nitride (CBN) blades are more effective. Optimal wafer cutting requires selecting the right abrasive concentration, abrasive size, cutting speed, and load. Precision wafering is essential for delicate samples or precise sectioning, with saw speeds ranging from 50-1500 rpm or 300-3000 rpm. High-speed saws are preferred for hard materials like ceramics, heat-treated steels, and minerals.
Wafer Blade Selection Guidelines
| Material | Characteristic | Speed (rpm) | Load (grams) | Blade (grit/conc.) |
|---|---|---|---|---|
| Silicon substrate | Soft/Brittle | <300 | <100 | Fine/Low |
| Gallium arsenide | Soft/Brittle | <200 | <100 | Fine/Low |
| Boron composites | Very brittle | 500 | 250 | Fine/Low |
| Ceramic fiber composites | Very brittle | 1000 | 500 | Fine/Low |
| Glasses | Brittle | 1000 | 500 | Fine/Low |
| Minerals | Friable/Brittle | >1500 | >500 | Fine/Low |
| Alumina ceramic | Hard/Tough | >1500 | >500 | Medium/Low |
| Zirconia (PSZ) | Hard/Tough | >3500 | >800 | Medium/Low |
| Silicon nitride | Hard/Tough | >3500 | >800 | Medium/Low |
| Metal matrix composites | — | >3500 | >500 | Medium/High |
| General purpose | — | Variable | Variable | Medium/High |
Precision Cutting Process Description
The most critical parameter in diamond sectioning is the abrasive size. Finer abrasives result in less damage, making them ideal for extremely brittle materials. Precision wafering saws are used for delicate samples requiring exact cuts, with factors like abrasive concentration, blade grit, and cutting speed all playing crucial roles in achieving the best results.
Recommended Precision Cutting Procedures
- Condition the wafering blade with the appropriate dressing stick to remove previous cutting swarf and smeared metal.
- Clamp the specimen properly to prevent movement during cutting.
- Use a rubber pad to absorb vibration when cutting brittle materials.
- Start the cut with a lower load to set the blade.
- Orient the specimen so that the cut is through the smallest cross-section.
- Use the largest appropriate blade flanges to prevent blade distortion.
- Reduce the load towards the end of the cut for brittle specimens to minimize fracturing.
- Use the appropriate cutting fluid for the material.
Precision Cutting Troubleshooting
| Symptom | Cause | Action |
|---|---|---|
| Chipped or broken blade | Improper blade dressing Insufficient clamping Too high initial load | Use mechanical dressing fixture Secure specimen with rubber pad Reduce initial load |
| Excessive blade wobble | Too high cutting load | Reduce applied load Use larger diameter support flanges |
| Low cutting rates | Smeared material on the blade Too low cutting speed/load | Redress blade Increase cutting speed/load Rotate specimen to minimize cutting area |
| Excessive specimen damage or chipping | Too large an abrasive Excessive vibration | Use finer grit diamond blade Secure specimen with rubber mounting pad |
| Burr formation on specimen at end of cut | Too high load/speed at end of cut Excessive vibration | Reduce speed/load Secure specimen with rubber mounting pads |
Precision Cutting Products
3-inch Diameter (76 mm) Wafering Blade, 1/2-inch (12.7 mm) Arbor
| Application | Conc. | Diamond Size | Thickness | Catalog Number | Product Images |
|---|---|---|---|---|---|
| Brittle materials (microelectronic materials, friable ceramics, minerals) | Low | Fine | 0.006-inch | WB-0030LC |
|
| Hard/tougher ceramics (Si3N4, ZrO2) | Low | Medium | 0.006-inch | WB-0035LC |
|
| Most metal samples | High | Medium | 0.006-inch | WB-0035HC |
|
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4-inch Diameter (102 mm) Wafering Blade, 1/2-inch (12.7 mm) Arbor
| Application | Conc. | Diamond Size | Thickness | Catalog Number | Product Images |
|---|---|---|---|---|---|
| Brittle materials (microelectronic materials, friable ceramics, minerals) | Low | Fine | 0.012-inch | WB-0040LC |
|
| Hard/tougher ceramics (Si3N4, ZrO2) | Low | Medium | 0.012-inch | WB-0045LC |
|
| Most metal samples | High | Medium | 0.012-inch | WB-0045HC |
|
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5-inch Diameter (127 mm) Wafering Blade, 1/2-inch (12.7 mm) Arbor
| Application | Conc. | Diamond Size | Thickness | Catalog Number | Product Images |
|---|---|---|---|---|---|
| Brittle materials (microelectronic materials, friable ceramics, minerals) | Low | Fine | 0.015-inch | WB-0050LC |
|
| Hard/tougher ceramics (Si3N4, ZrO2) | Low | Medium | 0.015-inch | WB-0055LC |
|
| Most metal samples | High | Medium | 0.015-inch | WB-0055HC |
|
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6-inch Diameter (153 mm) Wafering Blade, 1/2-inch (12.7 mm) Arbor
| Application | Conc. | Diamond Size | Thickness | Catalog Number | Product Images |
|---|---|---|---|---|---|
| Brittle materials (microelectronic materials, friable ceramics, minerals) | Low | Fine | 0.018-inch | WB-0060LC |
|
| Hard/tougher ceramics (Si3N4, ZrO2) | Low | Medium | 0.018-inch | WB-0065LC |
|
| Most metal samples | High | Medium | 0.018-inch | WB-0065HC |
|
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7-inch Diameter (178 mm) Wafering Blade, 1/2-inch (12.7 mm) Arbor
| Application | Conc. | Diamond Size | Thickness | Catalog Number | Product Images |
|---|---|---|---|---|---|
| Brittle materials (microelectronic materials, friable ceramics, minerals) | Low | Fine | 0.020-inch | WB-0070LC |
|
| Hard/tougher ceramics (Si3N4, ZrO2) | Low | Medium | 0.020-inch | WB-0075LC |
|
| Most metal samples | High | Medium | 0.020-inch | WB-0075HC |
|
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8-inch Diameter (203 mm) Wafering Blade, 1/2-inch (12.7 mm) Arbor
| Application | Conc. | Diamond Size | Thickness | Catalog Number | Product Images |
|---|---|---|---|---|---|
| Brittle materials (microelectronic materials, friable ceramics, minerals) | Low | Fine | 0.024-inch | WB-0080LC |
|
| Hard/tougher ceramics (Si3N4, ZrO2) | Low | Medium | 0.024-inch | WB-0085LC |
|
| Most metal samples | High | Medium | 0.024-inch | WB-0085HC |
|
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Electroplated Wafering Blades, 1/2-inch (12.7 mm) Arbor
| Application | Conc. | Diamond Size | Thickness | Catalog Number | Product Images |
|---|---|---|---|---|---|
| 4-inch electroplated diamond wafering blade (soft gummy materials such as plastics, rubber, and soft metals) | Low | Fine | 0.030-inch | WB-040EPD |
|
| 5-inch electroplated diamond wafering blade (soft gummy materials such as plastics, rubber, and soft metals) | Low | Medium | 0.030-inch | WB-050EPD |
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| 6-inch electroplated diamond wafering blade (soft gummy materials such as plastics, rubber, and soft metals) | High | Medium | 0.030-inch | WB-060EPD |
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| 7-inch electroplated diamond wafering blade (soft gummy materials such as plastics, rubber, and soft metals) | High | Medium | 0.030-inch | WB-070EPD |
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| 8-inch electroplated diamond wafering blade (soft gummy materials such as plastics, rubber, and soft metals) | High | Medium | 0.030-inch | WB-080EPD |
|
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CBN Wafering Blades, 1/2-inch (12.7 mm) Arbor
| Application | Conc. | Diamond Size | Thickness | Catalog Number | Product Images |
|---|---|---|---|---|---|
| 4-inch CBN wafering blade (medium grit, high concentration) | High | Medium | 0.012-inch | WCBN-0045 |
|
| 5-inch CBN wafering blade (medium grit, high concentration) | High | Medium | 0.015-inch | WCBN-0055 |
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| 6-inch CBN wafering blade (medium grit, high concentration) | High | Medium | 0.018-inch | WCBN-0065 |
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| 7-inch CBN wafering blade (medium grit, high concentration) | High | Medium | 0.020-inch | WCBN-0075 |
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| 8-inch CBN wafering blade (medium grit, high concentration) | High | Medium | 0.024-inch | WCBN-0085 |
|
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CBN/Diamond Hybrid Wafering Blades, 1/2-inch (12.7 mm) Arbor
| Application | Conc. | Diamond Size | Thickness | Catalog Number | Product Images |
|---|---|---|---|---|---|
| 4-inch CBN/Diamond Hybrid Wafering Blade (medium grit, high concentration) | High | Medium | 0.012-inch | WCBND-0045 |
|
| 5-inch CBN/Diamond Hybrid Wafering Blade (medium grit, high concentration) | High | Medium | 0.015-inch | WCBND-0055 |
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| 6-inch CBN/Diamond Hybrid Wafering Blade (medium grit, high concentration) | High | Medium | 0.018-inch | WCBND-0065 |
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| 7-inch CBN/Diamond Hybrid Wafering Blade (medium grit, high concentration) | High | Medium | 0.020-inch | WCBND-0075 |
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| 8-inch CBN/Diamond Hybrid Wafering Blade (medium grit, high concentration) | High | Medium | 0.024-inch | WCBND-0085 |
|
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Cutting Fluid
| Description | Quantity | Catalog Number | Product Images |
|---|---|---|---|
| DIACUT™ Water-based wafer cutting fluid | 16 oz (0.47l) 32 oz (0.94l) |
WL-3000-16 WL-3000-32 |
|
| DIACUT™ 2 Water-based wafer cutting fluid with anti-corrosion additive | 16 oz (0.47l) 32 oz (0.94l) |
WL2-3000-16 WL2-3000-32 |
|
| DIACUT™ Oil-based wafer cutting fluid | 16 oz (0.47l) 32 oz (0.94l) |
OL-3000-16 OL-3000-32 |
|
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Miscellaneous
| Description | Quantity | Catalog Number |
|---|---|---|
| DIACUT Dressing sticks (medium grit) | Each | DRES-0010 |