CLASS 11 Material Preparation Guide

Class 11: Very Hard, Brittle Materials

Class 11 includes extremely hard and brittle materials such as cermets, minerals, and technical glasses. Cermets like tungsten carbide combine ceramic hardness with metallic toughness, making them ideal for cutting tools, dies, and high-wear environments. These materials require advanced preparation techniques to preserve microstructural integrity during metallographic analysis.

Hardness Range
> 1500 HV
Typical Materials
Tungsten Carbide, Cermets, Glass, Quartz, Garnet, Industrial Minerals
Preparation Challenge
Advanced CMP & Tough Particle Surfaces

Material Categories

Cermets

Common Types
  • Tungsten Carbide (WC-Co)
  • TiC-Ni, TiCN-NiMo
  • Chromium-Based Cermets
Key Features
  • High wear resistance
  • Combination of toughness and hardness
  • Common in cutting tools and dies

Glasses

Examples
  • Borosilicate Glass
  • Fused Silica
  • Aluminosilicate Glass
Key Features
  • High hardness and brittleness
  • Low ductility, high thermal stability
  • Transparent or translucent phases

Minerals

Common Types
  • Quartz
  • Garnet
  • Spinel
Considerations
  • Grain boundary sensitivity
  • Highly brittle fracture behavior
  • Require low-force prep methods

Preparation Guide

Key Preparation Challenges

Hardness Gradient

Significant hardness differences between phases can lead to polishing relief and uneven surfaces.

Particle Pull-Out

Tough particles may detach if not supported or if polishing pressure is too high.

Surface Planarity

Maintaining flat surfaces is critical for coatings, interfaces, and hardness testing.

Microcracking

Fracture at grain boundaries or inclusions can occur if grinding force is excessive.

Recommended Preparation Steps

Sectioning

Use low-speed diamond or CBN blades with abundant coolant. Minimize vibration to avoid cracking.

Mounting

Castable, edge-retaining resins are preferred. Vacuum impregnation helps preserve surface planarity.

Grinding

Use semi-fixed diamond abrasives on metal mesh cloths for controlled abrasion and minimal damage.

Polishing

Apply diamond abrasives followed by CMP with SIAMATâ„¢ colloidal silica for minimal relief and high surface quality.

Quality Verification

Surface free from particle pull-out or microcracks

Flat, uniform polish across hard and soft phases

Grain boundaries and interfaces clearly resolved

No polishing relief or smearing in hard phases