Metallographic Precision Wafering

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1 / 5
Metallographic Wafering Blades
Precision Wafering Blades
Diamond and/or CBN Abrasives)
2 / 5
Metallographic Stainless Steel Wafering Blades
Precision Wafering Blades
with Stainless Steel Core
3 / 5
Metallographic Electroplated Wafering Blades
Electroplated Diamond Blades
(soft / gummy materials)
4 / 5
Metallographic Precision Cutting Abrasive Blades
Precision Cutting
Abrasive Blades
5 / 5
Metallographic Precision Cutting Fluid
DIACUT Cutting Fluid
with anticorrosion formulation

Wafering Blades Characteristics
  • Abrasives:
    • Diamond: Hardest known abrasive, excellent for most materials (not recommended for heat-treated steels)
    • Cubic Boron Nitride (CBN): 2nd hardest known abrasive, used for cutting heat-treated steels
    • Hybrid: Combination of diamond and CBN, useful for all materials
  • Abrasive Concentration:
    • Low Concentration: Recommended for cutting ceramics, glass, and minerals
    • High Concentration: Recommended for cutting metals and composite materials
  • Abrasive Size:
    • Fine grit: 15 micron abrasive, for cutting brittle and easy-to-chip/fracture materials such as silicon chips and glass
    • Medium grit: 70 micron abrasive, for cutting more ductile materials
  • Blade Core Material:
    • Steel core with copper flash: Most common precision wafering blade
    • Stainless steel core: More corrosion resistant and economical
  • Abrasive Bond:
    • Pressed: Abrasive is mixed in a powder and pressed at high pressure
    • Electroplated: Diamond is plated in a nickel bond, raised abrasive for coarser cutting, useful for cutting soft smearable materials



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