Final Polishing Abrasives

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Metallographic Polycrystalline NANOMETER Alumina
Polycrystalline NANOMETER Alumina
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Metallographic Fine Alumina Polishing Powder
Fine Alumina Polishing Powder
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Metallographic Electronics Deagglomerated Polishing Slurry
Electronics Deagglomerated Polishing Slurry
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Metallographic NANO Alumina Polishing Slurry
NANO Alumina Polishing Slurry
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Metallographic Colloidal Silica Suspensions
Colloidal Silica Suspensions
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Metallographic CMP Polishing Suspensions
Chemical Mechanical (CMP) Polishing Suspensions

Alumina Polishing:

NANOMETER Alumina: RECOMMENEDED for final polishing. This is a polycrystalline alumina abrasive with a more controlled particle size distribution and harder alpha alumina crystal.

Deagglomerated Alumina: Special processing used to breakdown agglomeration. The most common traditional polishing alumina abrasive.

NANO Slurries: Lower cost alumina polishes - useful for harder materials

Calcined Alumina Powders: Very common alumina polishing abrasives

Chemical Mechanical (CMP) Polishing:

Colloidal Silica: Very useful for polishing ceramics, glass and minerals.

CMP Slurry: A mixture of polycrystalline alumina and colloidal silica, provides faster polishing and less polishing relief on metals as compared to colloidal silica alone

Final Polishing Abrasives
PACE Technologies alumina powders PACE Technologies metallographic alumina final polishing slurries and suspensions PACE Technologies metallographic colloidal silica and CMP final polishing slurries and suspensions



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