Metal | Rough Polishing (Diamond) | Final Polishing (oxide) | ||||
---|---|---|---|---|---|---|
Abrasive size | 9 um | 6 um | 3 um | 1 um | Al2O3 | SiO2 |
Aluminum | ||||||
Copper/ brass |
||||||
Stainless steel | ||||||
Soft steel | ||||||
Hard steel | ||||||
Tool steel | ||||||
Titanium | ||||||
Zinc, tin, lead |
Ceramic/ Composite | Coarse Grind |
Fine Grind | Rough Polish | Fine Polish | ||
---|---|---|---|---|---|---|
Diamond size | 30 um | 15 um | 9 um | 6 um | 3 um | 1um + SiO2 |
Alumina | ||||||
Silicon nitride | ||||||
Polymer composite | ||||||
Metal matrix composite | ||||||
Ceramic matrix composite | ||||||
Cermet |
Symptom | Cause | Action |
---|---|---|
Agglomerated diamond |
-Pre-mixing diamond suspension with colloidal silica -Bacterial growth in diamond suspension |
-Alternate dispensing of diamond and colloidal silica -Replace diamond |
Coarse scratches |
-Contaminated pad -Improper selection of polishing pad |
-Replace polishing pad Review polishing pad selection guide-line or use a softer polishing pad |