Tungsten Refractory
Specimen Preparation (Class 2 Procedures)
 |
Preparation of tungsten can produce a surface deformation layer during rough polishing. This layer can be removed by light etching the surface with Murakami's reagent prior to final polishing.
SECTIONING
MAXCUT Abrasive blade (Cat. No. MAX-I series)
MOUNTING
Compression Mounting with Phenolic, Epoxy or Diallyl Phthalate compression mounting resins
POLISHING
| Abrasive/surface | Lubricant | Force/ sample | Speed (Head/base) |
Time | Individual Force mode |
Central Force mode |
|---|---|---|---|---|---|---|
| P120 grit ALO paper* P220 grit ALO paper* |
Water | 5-10 lbs | 100/100 rpm | Planar 1 min |
 |
|
| P500 grit ALO paper P1200 grit ALO paper |
Water | 5-10 lbs | 100/100 rpm | 1 min 1 min |
 |
|
| 1 um DIAMAT diamond on ATLANTIS polishing pad |
Water | 5-10 lbs | 100/100 rpm | 2 min | |
|
| 0.05 um acidic Nanometer acid alumina on a BLACKCHEM 2 pad |
Polishing with 10% Tungsten - |
5-10 lbs | 100/100 rpm | 1 min | |
|
*Required for central polishing force. Click here for more information on central vs. individual polishing force polishing.
 |
| Tungsten refractory metal, 200X (DIC), etched with Murakami's reagent. |
ETCHING
Common Etchants
CAUTION:Safety is very important when etching. Be sure to wear the appropriate protective clothing and observe all WARNINGS on chemical manufacuters SDS (Safety Data Sheets). Also review the COMMENTS and CONDITIONS Section for each etchant.
Copyright 2006-2024
|
