Smelter Slag
Specimen Preparation (Class 11 Procedures)
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Proper microstructural preparation of slags requires proper cutting or sectioning with a fine grit diamond blade (Figure 1 and 2). If the slag (glass) is chipped or excessively cracked during sectioning it may be impossible to remove the damage.
Planar grinding is best accomplished with a semi-fixed diamond on a metal mesh cloth. Intermediate grinding and polishing is accomplished by combining the mechanical component of diamond abrasives with the chemical polishing effect of colloidal silica. Final polishing on a resilient polishing pad such as BLACK CHEM using SIAMAT colloidal silica produces a damage free surface ready for examination (Figure 3).
SECTIONING
Diamond Wafering blade - fine grit / low concentration)MOUNTING
Castable Mounting with Epoxy or Acrylic resinsPOLISHING
| Abrasive/surface | Lubricant | Force/ sample | Speed (Head/base) |
Time | Individual Force mode |
Central Force mode |
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| 70 micron diamond grinding disk* |
Water | 5-10 lbs | 200/200 rpm | Planar |
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| 30 um DIAMAT diamond suspension on CERMESH Metal Mesh cloth |
5-10 lbs | 200/200 rpm | 5 min |  |
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| 6 um DIAMAT diamond on TEXPAN polishing pad |
SIAMAT colloidal silica |
10 lbs | 200/200 rpm | 5 min | |
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| 1 um DIAMAT diamond on GOLDPAD or ATLANTIS polishing pad |
SIAMAT colloidal silica |
10 lbs | 200/200 rpm | 5 min | |
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| SIAMAT Colloidal silca on TEXPAN polishing pad |
10 lbs | 200/200 rpm | 5 min | |
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*Required for central polishing force. Click here for more information on central vs. individual polishing force polishing.
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| Fine grit diamond wafering blade | Medium grit diamond wafering blade |
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| Slag, 100X (Polarized light), as polished condition |
ETCHING
Common Etchants
CAUTION:Safety is very important when etching. Be sure to wear the appropriate protective clothing and observe all WARNINGS on chemical manufacuters SDS (Safety Data Sheets). Also review the COMMENTS and CONDITIONS Section for each etchant.
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