SiC fibers in Silicon Nitride (5% mullite) Matrix (CMC)
Specimen Preparation (Class 10 Procedures)
 |
The key to proper specimen preparation of hard / brittle ceramic matrix composite materials is to first section the sample with the appropriate diamond wafer blade, rough grind with as fine a semi-fixed abrasive as possible, followed by the use of CMP (chemical mechanical polishing) techniques.
SECTIONING
Diamond Wafering blade - medium grit / low concentration
MOUNTING
Castable Mounting with Epoxy or Acrylic resins.
POLISHING
| Abrasive/surface | Lubricant | Force/ sample | Speed (Head/base) |
Time | Individual Force mode |
Central Force mode |
|---|---|---|---|---|---|---|
| 70 micron diamond grinding disk* |
Water | 5-10 lbs | 200/200 rpm | Planar |
 |
|
| 30 um DIAMAT diamond suspension on CERMESH Metal Mesh cloth |
5-10 lbs | 200/200 rpm | 5 min |  |
|
|
| 9 um DIAMAT diamond on POLYPAD polishing pad |
DIALUBE Purple Extender |
5-10 lbs | 200/200 rpm | 5 min | |
|
| 6 um DIAMAT diamond on TEXPAN polishing pad |
SIAMAT colloidal silica |
10 lbs | 200/200 rpm | 5 min | |
|
| 1 um DIAMAT diamond on GOLDPAD or ATLANTIS polishing pad |
SIAMAT colloidal silica |
10 lbs | 200/200 rpm | 5 min | |
|
| SIAMAT Colloidal silca on BLACKCHEM 2 polishing pad |
10 lbs | 200/200 rpm | 5 min | |
|
*Required for central polishing force. Click here for more information on central vs. individual polishing force polishing.
 |
| SiC fibers in a Silicon Nitride (5% mullite) matrix, 100X (B.F.), as polished condition |
 |
| SiC fibers in a mismatched matrix, 100X (DIC), as polished condition |
Common Etchants
CAUTION:Safety is very important when etching. Be sure to wear the appropriate protective clothing and observe all WARNINGS on chemical manufacuters SDS (Safety Data Sheets). Also review the COMMENTS and CONDITIONS Section for each etchant.
Copyright 2006-2024
|
