Piezoelectric (PZT) Device
Specimen Preparation (Class 4 Procedures)
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PZT, or piezoelectric, devices are very useful because they generate a voltage when mechanically deformed or vice versa.
PZT's are typically composed of lead, zirconium and titanate, which are processed at extremely high temperatures. PZT devices present the same challenges as polishing other brittle materials; however, they present the additional challenge of preparing other materials with significantly different properties (packaging materials, solders, coating, etc.). Specimen preparation must eliminate the preparation induced artifacts, as well as maintain the planarity of the specimen.
SECTIONING
Diamond wafering blade - medium grit/low concentration (if required)
MOUNTING
Castable epoxy or acrylic resins
POLISHING
| Abrasive/surface | Lubricant | Force/ sample | Speed (Head/base) |
Time | Individual Force mode |
Central Force mode |
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| 600 grit SiC paper |
Water |
5-10 lbs | 200/200 rpm | Planar |
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| 1200 grit SiC paper | Water |
5-10 lbs | 100/100 rpm | 2 min |
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| 1 um DIAMAT diamond on GOLDPAD polishing pad |
5-10 lbs | 100/100 rpm | 3-5 min | |
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| 0.05 micron Nanometer Alumina on BLACKCHEM 2 polishing pad |
10 lbs | 100/100 rpm | 3-5 min | |
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| SIAMAT colloidal silica on a BLACKCHEM 2 polishing pad |
5-10 lbs | 100/100 rpm | 1 min | |
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*Required for central polishing force. Click here for more information on central vs. individual polishing force polishing.
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| PZT cross section with sputter coating, 200,000X, as polished |
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| Undesirable void in PZT, 31,000X, as polished |
ETCHING
Common Etchants
CAUTION:Safety is very important when etching. Be sure to wear the appropriate protective clothing and observe all WARNINGS on chemical manufacuters SDS (Safety Data Sheets). Also review the COMMENTS and CONDITIONS Section for each etchant.
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