Electronic Materials Metallographic Preparation
Specimen Preparation (Class 4 Procedures)
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Description:
Electronic and microelectronic materials are composed of a wide variety of materials, ranging from Pb-Sn solders to ceramic packages which have both soft and very hard materials.
| Typical Material | Package Component | Physical Properties |
|---|---|---|
| Alumina, Aluminum Nitride, Beryllium oxide |
Packing body | Hard, brittle |
| Au / Si | Die attach | Soft |
| Ni/Fe/Co | Leads/lids | Tough, ductile |
| Au and/or Ni | Plating | Soft, ductile |
Silicon |
IC chip |
Brittle |
| Ag/Cu | Lead braze | Soft, ductile |
| Pb/Sn | Solder | Soft |
| Tungsten | Coating refractory | Hard, tough |
| Aluminum | Bonded Wires | Soft |
Preparation Challenge:
These materials require minimizing the amount of damaged produced during sectioning as well as polishing process which maintain the integrity of the specimens different hardness components.
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