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Tungsten Refractory Specimen Preparation

Preparation of tungsten can produce a surface deformation layer during rough polishing. This layer can be removed by light etching the surface with Murakami's reagent prior to final polishing.

SECTIONING
MAXCUT Abrasive blade (Cat. No. MAX-I series)

MOUNTING
Compression Mounting with Phenolic, Epoxy or Diallyl Phthalate compression mounting resins

POLISHING

Abrasive/surface

Lubricant

Force/ sample

Speed
(Head/base)

Time

P220 grit ALO paper
P500 grit ALO paper
P1200 grit ALO paper

Water

5-10 lbs

100/100 rpm

Until plane
1 minute
1 minute

1 micron DIAMAT diamond on ATLANTIS polishing pad

DIALUBE Purple Extender

5-10 lbs

100/100 rpm

1 minute

0.05 um acidic Nanometer acid alumina on a BLACKCHEM 2 pad

Polishing with 10% Diluted etchant below:

Tungsten -
15 ml HNO3, 3 ml HF (40%), 80 ml water

5-10 lbs

100/100 rpm

1 minute



Metallographic micrograph of tungsten refractory

Tungsten refractory metal, 200X (DIC), etched with Murakami's reagent.

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