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Tungsten Carbide (CERMET) Specimen Preparation

The key to proper specimen preparation of hard / tough CERMET materials such as tungsten carbide is to to grind with a semi-fixed abrasive (polycrystalline diamond on a metal mesh cloth), followed by combining diamond abrasive with a CMP (chemical mechanical polishing) abrasive such as SIAMAT colloidal silica.

SECTIONING

Diamond Wafering blade - medium grit / low concentration

MOUNTING
Castable Mounting with Epoxy or Acrylic resins

POLISHING

Abrasive/surface

Lubricant

Force/ sample

Speed
(Head/base)

Time

30 um DIAMAT diamond suspension on CERMESH Metal Mesh cloth DIALUBE Diamond Extender 5-10 lbs

200/200 rpm

Until plane
9 um DIAMAT diamond on POLYPAD polishing pad DIALUBE Diamond Extender 5-10 lbs

200/200 rpm

3 minutes
3 um DIAMAT diamond on TEXPAN polishing pad DIALUBE Diamond Extender 5-10 lbs

200/200 rpm

3 minutes

1 um DIAMAT diamond on ATLANTIS polishing pad

SIAMAT colloidal silica

5-10 lbs

200/200 rpm

3 minutes


Metallographic micrograph of Tunsten carbide

Tungsten carbide, 1500X (DIC), etched with 50% HNO3 and 50% HCl

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PACE Technologies ® - 3601 E. 34th St. - Tucson, AZ 85713 USA
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