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Tough Pitch Copper Specimen Preparation

Metallographic etchant database

Copper and copper alloys are difficult to prepare because they have a tendency to work harden and have oxide inclusions. The result is that the oxide inclusions can become dislodged and scratch the surface. This scratching is more apparent following etching.

To minimize oxide pull-out, preparation damage can be minimized by using alumina grinding papers and polishing with polycrystalline diamond for the intermediate polishing step, followed by polishing with polycrystalline alumina.

SECTIONING
MAXCUT Abrasive blade (Cat. No. MAX-C or MAX-I series)

MOUNTING
Compression Mounting with Phenolic, Epoxy or Diallyl Phthalate compression mounting resins

POLISHING

Abrasive/surface

Lubricant

Force/ sample

Speed
(Head/base)

Time

P240 grit ALO paper
P500 grit ALO paper
P1200 grit ALO paper

Water

5-10 lbs

100/100 rpm

Until plane
1 minute
1 minute

1 um DIAMAT diamond on ATLANTIS polishing pad

DIALUBE Purple Extender

5-10 lbs

100/100 rpm

2 minutes

0.05 um Nanometer alumina on NAPPAD polishing pad

 

5-10 lbs

100/100 rpm

1 minute


Metallographic preparation for Tough Pitch Copper

Tough Pitch Copper, B.F. 100X, Etchant NH4OH / H2O2

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