The microstructural preparation of electronic packages presents some very difficult challenges, such as abrasives embedding in very soft solder joints, edge rounding, polishing relief between very hard (ceramic) or brittle (silicon) materials and the very soft plastic and metal solders. The use of alumina lapping films are very useful for maintaining flatness and for minimizing fractured abrasive embedding for non-ceramic substrates. For specimens with ceramic substrates, diamond lapping films are recommended.
SECTIONING
Diamond wafering blade - medium grit/low concentration
MOUNTING
Castable epoxy or acrylic resins
POLISHING
Abrasive/surface |
Lubricant |
Force/ sample |
Speed |
Time |
15 micron diamond lapping film |
POLYLUBE Extender |
5-10 lbs |
100/100 rpm |
Until plane |
9 micron diamond lapping film |
POLYLUBE Extender |
5-10 lbs |
100/100 rpm |
Until plane |
6 micron diamond lapping film |
POLYLUBE Extender |
5-10 lbs |
100/100 rpm |
Until plane |
3 micron diamond lapping film |
POLYLUBE Extender |
5-10 lbs |
100/100 rpm |
Until plane |
1 um DIAMAT diamond on ATLANTIS polishing pad |
DIALUBE Purple Extender |
5-10 lbs |
100/100 rpm |
1 minute |
SIAMAT colloidal silica on a MICROPAD 2 polishing pad |
|
5-10 lbs |
100/100 rpm |
1 minute |
 |
Electronic die cross section (compliments of Analog Devices). |
 |
| Electronic die cross section (compliments of Analog Devices). |
