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Solder Joints on Ceramic Substrates Specimen Preparation

Metallographic etchant database

The microstructural preparation of electronic packages presents some very difficult challenges, such as abrasives embedding in very soft solder joints, edge rounding, polishing relief between very hard (ceramic) or brittle (silicon) materials and the very soft plastic and metal solders. The use of alumina lapping films are very useful for maintaining flatness and for minimizing fractured abrasive embedding for non-ceramic substrates. For specimens with ceramic substrates, diamond lapping films are recommended.

SECTIONING

Diamond wafering blade - medium grit/low concentration

MOUNTING
Castable epoxy or acrylic resins

POLISHING

Abrasive/surface

Lubricant

Force/ sample

Speed
(Head/base)

Time

15 micron diamond lapping film

POLYLUBE Extender

5-10 lbs

100/100 rpm

Until plane

9 micron diamond lapping film

POLYLUBE Extender

5-10 lbs

100/100 rpm

Until plane

6 micron diamond lapping film

POLYLUBE Extender

5-10 lbs

100/100 rpm

Until plane

3 micron diamond lapping film

POLYLUBE Extender

5-10 lbs

100/100 rpm

Until plane

1 um DIAMAT diamond on ATLANTIS polishing pad

DIALUBE Purple Extender

5-10 lbs

100/100 rpm

1 minute

SIAMAT colloidal silica on a MICROPAD 2 polishing pad

 

5-10 lbs

100/100 rpm

1 minute


Electronic die on a ceramic substrate microsctructure

Electronic die cross section (compliments of Analog Devices).

Electronic die cross section microstructure
Electronic die cross section (compliments of Analog Devices).
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