Proper microstructural preparation of slags requires proper cutting or sectioning with a fine grit diamond blade (Figure 1 and 2). If the slag (glass) is chipped or excessively cracked during sectioning it may be impossible to remove the damage.
Planar grinding is best accomplished with a semi-fixed diamond on a metal mesh cloth. Intermediate grinding and polishing is accomplished by combining the mechanical component of diamond abrasives with the chemical polishing effect of colloidal silica. Final polishing on a resilient polishing pad such as BLACK CHEM using SIAMAT colloidal silica produces a damage free surface ready for examination (Figure 3).
SECTIONING
Diamond Wafering blade - fine grit / low concentration
MOUNTING
Castable Mounting with Epoxy or Acrylic resins
POLISHING
Abrasive/surface |
Lubricant |
Force/ sample |
Speed |
Time |
| 30 um DIAMAT diamond suspension on CERMESH Metal Mesh cloth | 5-10 lbs | 200/200 rpm |
Until plane | |
| 6 um DIAMAT diamond on TEXPAN polishing pad | SIAMAT colloidal silica | 10 lbs | 200/200 rpm |
5 minutes |
1 um DIAMAT diamond on GOLDPAD polishing pad |
SIAMAT colloidal silica |
10 lbs |
200/200 rpm |
5 minutes |
SIAMAT Colloidal silca on TEXPAN polishing pad |
|
10 lbs |
100/100 rpm |
5 minutes |
 |
 |
|
Figure 1. Fine grit diamond cut of glass |
Figure 2. Medium grit diamond cut of glass |
 |
Slag, 100X (Polarized light), as polished condition |
