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Silicon Substrate
Specimen Preparation (Class 4 Procedures)
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Specimen preparation of friable or brittle materials such as silicon offer a microstructural preparation challenge. Proper microstructural preparation of these materials must minimize fracturing the silicon structure. This is accomplished by first by cutting or sectioning with fine grit / low concentration diamond blades. Oftentimes microelectronic cross sections are not encapsulated and just mounted using a hot melt tape. If the specimens are encapsulated, a castable mounting compound such as an acrylic or an epoxy is recommended. Initial grinding and polishing with diamond lapping films is required to prevent undue damage to the silicon during grinding. Rough polishing is accomplished on low napped polishing cloths using diamond, with final polishing for a very short time on a high napped cloth using collodial silica.
SECTIONING
Diamond Wafering blade - fine grit / low concentration
MOUNTING
Hot melt tape or castable mounting with Epoxy or Acrylic resins
POLISHING
| Abrasive/surface | Lubricant | Force/ sample | Speed (Head/base) |
Time | Individual Force mode |
Central Force mode |
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| 30 um Diamond Lapping Film* |
POLYLUBE Diamond Extender |
5-10 lbs | 200/200 rpm | Planar |
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| 15 um Diamond Lapping Film* |
POLYLUBE Diamond Extender |
5-10 lbs | 200/200 rpm | 3 min |  |
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| 9 um Diamond Lapping Film* |
POLYLUBE Diamond Extender |
5-10 lbs | 200/200 rpm | 2 min | |
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| 6 um Diamond Lapping Film* |
POLYLUBE Diamond Extender |
5-10 lbs | 200/200 rpm | 2 min | |
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| 3 um Diamond Lapping Film* |
POLYLUBE Diamond Extender |
5-10 lbs | 200/200 rpm | 2 min | |
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| 1 um DIAMAT diamond on ATLANTIS polishing pad |
DIALUBE Purple Lubricant |
5-10 lbs | 200/200 rpm | 1 min | |
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| MICROPAD or MICROPAD 2 polishing pad |
Colloidal silica | 5-10 lbs | 200/200 rpm | 30 sec | |
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*Required for central polishing force. Click here for more information on central vs. individual polishing force polishing.
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| Fine grit diamond wafering blade | Medium grit diamond wafering blade |
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| Electronic package | Electronic package |
ETCHING
Common Etchants
CAUTION:Safety is very important when etching. Be sure to wear the appropriate protective clothing and observe all WARNINGS on chemical manufacuters SDS (Safety Data Sheets). Also review the COMMENTS and CONDITIONS Section for each etchant.
PACE TECHNOLOGIES CONTACT
PACE Technologies
3601 E. 34th St.
Tucson, Arizona 85713
+1-520-882-6598
FAX +1-520-882-6599
email: pace@metallographic.com
https://www.metallographic.com
Information Requests
Copyright 2006-2022
PACE TECHNOLOGIES® -
3601 E. 34th St., Tucson, AZ 85713,
USA
Telephone +1-520-882-6598 FAX +1-520-882-6599
All Rights Reserved
