Metallographic equipment and consumables best price guarantee
PACE Technologies Home Page for metallographic equipment and consumables for metallography

PACE Technologies Home Page | Home | Consumables | Equipment | Safety Data Sheets | Procedures | Etchants | Service | Contact us |

Silicon Nitride Engineering Ceramic Specimen Preparation

The key to proper specimen preparation of hard / tough ceramic materials such as silicon nitride (Si3N4) is to grind with a semi-fixed abrasive (polycrystalline diamond on a metal mesh cloth), followed by the use of CMP (chemical mechanical polishing) techniques using colloidal silica.

SECTIONING

Diamond Wafering blade - medium grit / low concentration

MOUNTING
Castable Mounting with Epoxy or Acrylic resins

POLISHING

Abrasive/surface

Lubricant

Force/ sample

Speed
(Head/base)

Time

30 um DIAMAT diamond suspension on CERMESH Metal Mesh cloth   5-10 lbs

200/200 rpm

Until plane
6 um DIAMAT diamond on TEXPAN polishing pad SIAMAT colloidal silica 10 lbs

200/200 rpm

5 minutes

1 um DIAMAT diamond on GOLDPAD polishing pad

SIAMAT colloidal silica

10 lbs

200/200 rpm

5 minutes

SIAMAT Colloidal silca on TEXPAN polishing pad

 

10 lbs

100/100 rpm

5 minutes


Metallographic micrograph of silicon nitride ceramics

Silicon Nitride polished with CMP techniques
400X (DIC) as polished

Metallographic micrograph of silicon nitride ceramics

Silicon Nitride polished by conventional 9,6,3,1,0.25 um diamond steps. Note that the damage is not removed even after long polishing times. 400X (DIC) as polished

About Us | Site Map | Web Disclaimer | Terms and Conditions | Contact Us
Copyright © 2006-2017
PACE Technologies ® - 3601 E. 34th St. - Tucson, AZ 85713 USA
Telephone +1 520-882-6598 FAX +1 520-882-6599.
All Rights Reserved.


PACE Technologies facebook link   Blog us on Tumblr   Blog us on Tumblr   PACE Technologies Google+   PACE Technologies Google+   PACE Technologies Google+