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20% SiC particles in 80% Zirconium Diboride Matrix Specimen Preparation

Metallographic etchant database

Specimen preparation of hard/brittle ceramics can be challenging. The key to the preparation of ceramics and ceramic-ceramic composites is to minimize damage at each preparation stage. This includes sectioning with the appropriate diamond wafering blade and using the finest practical abrasive for initial grinding. Polishing with SIAMAT colloidal silica provides a chemical mechanical polishing (CMP) action which is the most effective means for eliminating both surface and subsurface damage. The combination of SIAMAT colloidal silica with DIAMAT polycrystalline diamond also produces the required surfaces finishes in a minimal amount of time.

SECTIONING

Diamond Wafering blade - medium grit / low concentration

MOUNTING
Castable Mounting with Epoxy or Acrylic resins

POLISHING

Abrasive/surface

Lubricant

Force/ sample

Speed
(Head/base)

Time

30 um DIAMAT diamond suspension on CERMESH Metal Mesh cloth   5-10 lbs

200/200 rpm

Until plane
9 um DIAMAT diamond on POLYPAD polishing pad DIALUBE Purple Extender 5-10 lbs

200/200 rpm

5 minutes
6 um DIAMAT diamond on TEXPAN polishing pad SIAMAT colloidal silica 10 lbs

200/200 rpm

5 minutes

1 um DIAMAT diamond on GOLDPAD polishing pad

SIAMAT colloidal silica

10 lbs

200/200 rpm

5 minutes

SIAMAT Colloidal silca on BLACKCHEM 2 polishing pad

 

10 lbs

100/100 rpm

5 minutes


Metallographic micrograph of SiC particles in ZrB2 matrix

20% SIC - 80% ZrB2 Ceramic, 1000X (DIC), as polished condition

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