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SiC particles in Silicon Nitride Matrix (CMC) Specimen Preparation

The key to proper specimen preparation of hard / brittle ceramic matrix composite materials is to first section it with the appropriate diamond wafer blade, grind with as fine a semi-fixed abrasive, followed by the use of CMP (chemical mechanical polishing) techniques.

SECTIONING

Diamond Wafering blade - medium grit / low concentration

MOUNTING
Castable Mounting with Epoxy or Acrylic resins

POLISHING

Abrasive/surface

Lubricant

Force/ sample

Speed
(Head/base)

Time

30 um DIAMAT diamond suspension on CERMESH Metal Mesh cloth   5-10 lbs

200/200 rpm

Until plane
9 um DIAMAT diamond on POLYPAD polishing pad DIALUBE Purple Extender 5-10 lbs

200/200 rpm

5 minutes
6 um DIAMAT diamond on TEXPAN polishing pad SIAMAT colloidal silica 10 lbs

200/200 rpm

5 minutes

1 um DIAMAT diamond on GOLDPAD polishing pad

SIAMAT colloidal silica

10 lbs

200/200 rpm

5 minutes

SIAMAT Colloidal silca on BLACKCHEM 2 polishing pad

 

10 lbs

100/100 rpm

5 minutes


Metallographic micrograph of silicon carbide particles in a silicon nitride matrix
SiC particles in a Si3N4 matrix , 1000X (DIC)
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